As the world becomes increasingly reliant on high-performance computing (HPC) and artificial intelligence (AI), the demand for efficient and scalable power solutions in data centers has never been greater.

Addressing this critical need, Texas Instruments (TI) has introduced a suite of innovative power-management chips designed to meet the growing energy requirements of modern data centers. These advancements, showcased at the 2025 Applied Power Electronics Conference (APEC) in Atlanta, Georgia, promise to redefine power efficiency and density in the digital infrastructure landscape.

Data centers are the backbone of our digital world, supporting everything from cloud computing to AI-driven applications. However, as these facilities evolve to handle more complex workloads, their power demands have skyrocketed. Traditional power architectures are struggling to keep up, prompting a shift toward 48V power systems that offer greater efficiency and scalability.

Introducing the TPS1685: A Game-Changer for High-Power Applications

At the heart of TI’s new offerings is the TPS1685, the industry’s first 48V integrated hot-swap eFuse with power-path protection. This device is specifically designed to address the high-power processing needs of data centers, supporting power levels beyond 6kW.

The TPS1685 simplifies design and reduces solution size by half compared to existing hot-swap controllers. Its stackable architecture allows for scalability, making it an ideal choice for powering CPUs, GPUs, and AI hardware accelerators. By integrating power-path protection, the TPS1685 ensures robust system reliability, even in the most demanding environments.

GaN Power Stages: Redefining Power Density and Efficiency

In addition to the TPS1685, TI has introduced a new family of integrated gallium nitride (GaN) power stages: the LMG3650R035, LMG3650R025, and LMG3650R070. These devices, housed in industry-standard TOLL (transformer outline leadless) packaging, are designed to deliver unprecedented levels of power density and efficiency.

GaN technology is a game-changer for power-supply designs, enabling high-frequency switching that reduces the size of passive components and increases overall system density. Compared to traditional silicon and silicon carbide (SiC) solutions, GaN devices offer lower switching, gate-drive, and reverse-recovery losses, resulting in higher efficiency.

The LMG365xR035 series features an integrated gate driver and robust protection mechanisms, including under-voltage lockout (UVLO), cycle-by-cycle overcurrent protection, short-circuit protection, and overtemperature protection. These integrated features not only enhance reliability but also reduce the need for external components, simplifying design and lowering costs.

Key Features and Benefits of the LMG365xR035 Series

Adjustable Slew Rates: Designers can independently control turn-on and turn-off slew rates, optimizing switching performance and mitigating electromagnetic interference (EMI). Turn-on slew rates range from 10V/ns to 100V/ns, while turn-off rates can be limited based on load current.
Zero-Voltage Detection (ZVD): This feature provides a pulse output when zero-voltage switching is achieved, reducing third-quadrant losses.
Compact TOLL Packaging: The 9.8mm × 11.6mm TOLL package with a thermal pad ensures high power density and efficient thermal management.
Wide Operating Range: The devices operate with supply pin and input logic pin voltages ranging from 9V to 26V, making them versatile for various applications.

Applications Across Industries

TI’s new power-management solutions are poised to transform multiple industries, particularly data centers and telecommunications.

1. Data Center Power-Supply Units (PSUs)

As data centers expand to support hyperscale computing, the need for highly efficient and power-dense PSUs is critical. TI’s GaN devices in the TOLL package enable designers to achieve efficiencies greater than 99% in the power factor correction (PFC) stage and greater than 98% in the DC/DC stage. These advancements are essential for reducing energy consumption and operational costs in large-scale data centers.

2. Telecommunications Infrastructure

The transition from 4G to 5G and the emergence of 6G have significantly increased the power requirements of telecommunications equipment. Despite these higher demands, the form factor of the equipment remains unchanged. TI’s integrated 650V TOLL devices provide a compact and efficient solution for converting AC power into a DC bus, ensuring reliable performance in space-constrained environments.

Why Integration Matters

Integration is a key theme in TI’s latest innovations. By combining the gate driver and protection circuitry into a single device, TI has simplified the design process and minimized parasitic coupling, which is particularly important in high-frequency power conversion. This integration not only enhances performance but also reduces the overall footprint of power-supply designs, enabling cleaner layouts and faster time-to-market.

Conclusion

Texas Instruments’ new power-management chips represent a significant leap forward in addressing the energy challenges of modern data centers. With the TPS1685 and LMG365xR035 series, TI is empowering designers to create more efficient, scalable, and reliable power solutions that meet the demands of an increasingly digital world.

As data centers continue to evolve, innovations like these will play a crucial role in ensuring that our digital infrastructure remains sustainable and capable of supporting the technologies of tomorrow. By leveraging TI’s cutting-edge solutions, data center operators can not only enhance performance but also contribute to a greener, more energy-efficient future.

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Vikky K

20+ years embedded hardware design professional with a burning passion for teaching. Sharing the intricate world of embedded hardware is my mission and joy.