Micron Takes the Lead with Release of 32Gb DRAM Die-based 128GB DDR5 RDIMM memory for Memory-Intensive Generative AI Applications

Micron Technology, Inc. has set a new benchmark in the tech industry with the delivery of its groundbreaking achievement – the validation and shipment of the world’s first 32Gb DRAM die-based 128GB DDR5 RDIMM memory. This milestone underscores Micron’s commitment to meeting the demanding speed and capacity requirements of memory-intensive Generation AI applications.

The newly launched 128GB DDR5 RDIMM (Registered Dual Inline Memory Module) from Micron is a testament to the company’s relentless pursuit of innovation. Powered by Micron’s cutting-edge 1β (1-beta) technology, this high-capacity monolithic 32Gb DRAM die-based memory module delivers exceptional performance, boasting speeds of up to 5,600 MT/s. What sets it apart is its remarkable improvements in key metrics – over 45% enhanced bit density, up to 22% improved energy efficiency, and up to 16% lower latency compared to competitive 3DS through-silicon via (TSV) products.

Designed to cater to the diverse needs of modern data centers, Micron’s 128GB DDR5 RDIMM is engineered to excel in a wide range of mission-critical applications. From artificial intelligence (AI) and machine learning (ML) to high-performance computing (HPC) and in-memory databases (IMDBs), this revolutionary memory solution promises efficient processing for multithreaded, multicore count general compute workloads.

Backing Micron’s endeavor is a robust ecosystem of industry leaders including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, and others. Notably, Micron’s 128GB DDR5 RDIMM is the first 32Gb monolithic DRAM-based high-capacity DIMM to have completed Intel platform memory compatibility qualification on 4th and 5th Gen Intel® Xeon® processors. This validation brings significant benefits in terms of performance, capacity, and power efficiency to Intel® Xeon® processor-based systems.

Leveraging Micron’s advanced 1β process node technology, the DDR5 128GB RDIMM sets new standards in system memory capacity and data rates, enabling up to 6TB of memory capacity and data rates of up to 8,000MT/s.

Micron’s commitment to innovation is further evidenced by its 1β technology, offering the industry’s fastest speed and lowest latency DDR5 based on a 32Gb monolithic die. Available in speeds ranging from 5600MT/s to 8000MT/s, Micron’s 1β 16Gb-based modules come in various densities, catering to both memory-intensive applications and general compute workloads.

One of the key areas where Micron’s DDR5 128GB RDIMM shines is in accelerating memory-bound workloads, such as training for Large Language Models (LLMs). Benchmark tests using Llama 2 showcased up to a 28% improvement in AI training performance compared to previous solutions.

Additionally, Micron’s DDR5 128GB RDIMM exhibited superior power efficiency, with results from Llama 2 indicating up to 48% lower power consumption compared to 3DS TSV RDIMM modules.

Micron’s 128GB DDR5 RDIMM memory is now available directly from Micron and will soon be accessible through select global channel distributors and resellers, starting June 2024.

This significant advancement marks a new era in memory technology, solidifying Micron’s position as a leader in the industry and paving the way for the future of AI data centers.

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Vikky K

20+ years embedded hardware design professional with a burning passion for teaching. Sharing the intricate world of embedded hardware is my mission and joy.